Stephen H. Hall & Howard L. Heck 
Advanced Signal Integrity for High-Speed Digital Designs 

A synergistic approach to signal integrity for high-speed
digital design

This book is designed to provide contemporary readers with an
understanding of the emerging high-speed signal integrity issues
that are creating roadblocks in digital design. Written by the
foremost experts on the subject, it leverages concepts and
techniques from non-related fields such as applied physics and
microwave engineering and applies them to high-speed digital
design–creating the optimal combination between theory and
practical applications.

Following an introduction to the importance of signal integrity,
chapter coverage includes:

* Electromagnetic fundamentals for signal integrity

* Transmission line fundamentals

* Crosstalk

* Non-ideal conductor models, including surface roughness and
frequency-dependent inductance

* Frequency-dependent properties of dielectrics

* Differential signaling

* Mathematical requirements of physical channels

* S-parameters for digital engineers

* Non-ideal return paths and via resonance

* I/O circuits and models

* Equalization

* Modeling and budgeting of timing jitter and noise

* System analysis using response surface modeling

Each chapter includes many figures and numerous examples to help
readers relate the concepts to everyday design and concludes with
problems for readers to test their understanding of the material.
Advanced Signal Integrity for High-Speed Digital Designs is
suitable as a textbook for graduate-level courses on signal
integrity, for programs taught in industry for professional
engineers, and as a reference for the high-speed digital
designer.

Sobre el autor

STEPHEN H. HALL is a Senior Staff Engineer at Intel
Corporation, where he leads a team focused on the research of new
modeling and measurement solutions for channel speeds as high as
30Gb/sec. Previously at Intel, he was the lead designer for desktop
and server buses on Pentium II, III, and IV based systems,
coordinated research in the area of high-speed signaling with
multiple universities, led research and development teams in the
area of high-speed modeling, and taught signal integrity courses to
engineers in two countries. He is also the author of High-Speed
Digital System Design (Wiley).

HOWARD L. HECK is a Principal Engineer at Intel
Corporation, where he leads development of the signaling
specifications and solutions for USB 3.0. He also teaches
high-speed digital interconnect design at the Oregon Graduate
Institute, is a Senior Member of the IEEE, and holds five patents
in the area of high-performance packaging and interconnects, with
five more pending.