Mikhail R. Baklanov
IMEC, Leuven, Belgium
Paul S. Ho
Laboratory for Interconnect and Packaging, University of Texas at Austin, Austin, Texas, USA
Ehrenfried Zschech
Fraunhofer Institute for Nondestructive Testing, Dresden, Germany
3 Ebooki wg Ehrenfried Zschech
Mikhail Baklanov & Paul S. Ho: Advanced Interconnects for ULSI Technology
Finding new materials for copper/low-k interconnects is critical to
the continuing development of computer chips. While copper/low-k
interconnects have served well, allowing for the creation of …
PDF
Angielski
DRM
€159.99
Mikhail Baklanov & Paul S. Ho: Advanced Interconnects for ULSI Technology
Finding new materials for copper/low-k interconnects is critical to
the continuing development of computer chips. While copper/low-k
interconnects have served well, allowing for the creation of …
EPUB
Angielski
DRM
€159.99
