ผู้เขียน: Rick Sturdivant

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developm …

Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which …

The use of electronically scanned phased arrays is increasing in systems such as radar, wireless networks, and satellite ground terminals. An important and necessary component for these systems is …

Phased arrays, while traditionally used in radar systems, are now being used or proposed for use in internet of things (Io T) networks, high-speed back haul communication, terabit-per-second …